Sense+ next generation automation platform for MEMS & Sensor is optimized for high test requirements and small and sensitive devices, achieving high throughput even for MEMS devices that require longer test times.
The Sense+ isolated architecture decouples the stimulus and test module from the handling system, enabling a significant increase in test accuracy and daily output compared to prior generation solutions. This All-in-One-System delivers the full backend process in one tool with high throughput test and inspection of small, delicate devices while creating less work-in-progress and better cost of test. Sense+ also provides customers the flexibility to reconfigure the system to test different sensors, thereby extending the useful life of the platform. Further, Sense+ automation platform supports handling and vision inspection of advanced MEMS such as wafer-level chip scale packages.
