Cohu’s proprietary T-Core thermal system’s controller provides precise, multi-site temperature management of power dissipation ICs, such as graphic chips and CPUs, optimizing test yield.
The T-Core thermal control system optimizes test yield at cold, ambient, and hot temperatures and offers better than +/- 1°C accuracy with response speeds of >125°C/sec. The system’s flexibility to control air, liquid, and refrigerant based thermal heads gives semiconductor manufacturers excellent temperature control capability for high volume manufacturing.
T-Core’s modularity and small form factor enable cost effective, seamless integration into Cohu’s pick-and-place handlers. T-Core provides customers with a single thermal system solution, from engineering development to final test volume production.
